Our greatest capacity is in through hole technology.
Our operators can read and interpret drawings, discover
and correct problems, do prototypes, rework, etc…
Capabilities
in SMT include manually assisted Pick and Place for a
high quality, high mix, low to mid range volume. The Pick
and Place is complemented with convection reflow and stencil-applied
solder paste.
With increasing demand, we are extending our surface
Mount assembly facilities.
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Capabilities
in SMT include manually assisted Pick and Place for a
high quality, high mix, low to mid range volume. The Pick
and Place is complemented with convection reflow and stencil-applied
solder paste. 
